JPH0316029Y2 - - Google Patents
Info
- Publication number
- JPH0316029Y2 JPH0316029Y2 JP3473384U JP3473384U JPH0316029Y2 JP H0316029 Y2 JPH0316029 Y2 JP H0316029Y2 JP 3473384 U JP3473384 U JP 3473384U JP 3473384 U JP3473384 U JP 3473384U JP H0316029 Y2 JPH0316029 Y2 JP H0316029Y2
- Authority
- JP
- Japan
- Prior art keywords
- syringe
- adhesive
- discharge hole
- nozzle discharge
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 75
- 230000001070 adhesive effect Effects 0.000 claims description 75
- 239000012530 fluid Substances 0.000 claims description 5
- 230000035939 shock Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Die Bonding (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3473384U JPS60146819U (ja) | 1984-03-09 | 1984-03-09 | 定量供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3473384U JPS60146819U (ja) | 1984-03-09 | 1984-03-09 | 定量供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60146819U JPS60146819U (ja) | 1985-09-30 |
| JPH0316029Y2 true JPH0316029Y2 (en]) | 1991-04-08 |
Family
ID=30538382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3473384U Granted JPS60146819U (ja) | 1984-03-09 | 1984-03-09 | 定量供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146819U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186243A (ja) * | 2002-11-29 | 2004-07-02 | Motoyama Eng Works Ltd | ブロックバルブ並びにモノブロックバルブ及びバルブの洗浄方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015064209A (ja) * | 2013-09-24 | 2015-04-09 | Smc株式会社 | 超音波流量計 |
-
1984
- 1984-03-09 JP JP3473384U patent/JPS60146819U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186243A (ja) * | 2002-11-29 | 2004-07-02 | Motoyama Eng Works Ltd | ブロックバルブ並びにモノブロックバルブ及びバルブの洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60146819U (ja) | 1985-09-30 |
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